PROCESSOR
Processor Support
Intel® Core™ i7 and Intel® Core™ i5 processors and other Intel® processors in the LGA1155 package
Supports Intel® 64 architecture

CHIPSET
Intel® Q77 Express Chipset
Intel® Q77 Platform Controller Hub (PCH)

PERIPHERAL CONNECTIVITY
6 SATA ports (2 SATA 6.0 Gb/s; 3 SATA 3.0 Gb/s headers; 1 eSATA rear port)
Dual Integrated 10/100/1000 Network Connection
4 Super-Speed USB 3.0 ports (2 back panel ports; 2 additional ports via internal headers)
8 Hi-Speed USB 2.0 ports (4 back panel ports - 2 support high power; and additional 4 ports via internal headers)

SYSTEM BIOS
96 Mb Flash EEPROM with Intel® Platform Innovation Framework for EFI Plug and Play
Advanced configuration and power interface V3.0b, SMBIOS 2.5
Intel® Express BIOS update support

SYSTEM MEMORY
Memory Capacity
Four 240-pin DIMM connectors supporting up to two double-sided DIMMs (32 GB5 max)
Memory Types
DDR3 16006 / 1333 SDRAM memory support
Non-ECC Memory Memory Modes
Dual- or single-channel operation support
Memory Voltage
 1.2 V to 1.8 V

HARDWARE MANAGEMENT FEATURES
Processor fan speed control
System chassis fan speed control
Voltage and temperature sensing
Fan sensor inputs used to monitor fan activity
ACPI-compliant power management control

INTEL® PRO 10/100/1000 NETWORK CONNECTION
Low-power design

EXPANSION CAPABILITIES
One PCI bus add-in card connector
One PCI Express* 2.0 x1 bus add-in card connector
One PCI Express* 2.0 x4 bus add-in card connector (open-ended with retaining clip)
One PCI Express 3.0 x16 graphics connector
One PCI Express* Mini (Full Length) - supports mSATA HEADERS
One serial port header
S/PDIF audio header
IEEE 1394a Controller internal header

AUDIO
Eight-channel dual-stream Intel® High Definition Audio3 codec

JUMPERS AND FRONT-PANEL CONNECTORS
Jumpers
Single configuration jumper design
Jumper access for BIOS maintenance mode
Front-Panel Connectors
Reset, HDD LED, power LEDs, power on/off
Front-panel Hi-Speed USB 2.0 headers
Front-panel audio header

MECHANICAL
Board Style
MicroATX 2.2-compliant
Board Size
9.6" × 9.6" (24.38 cm × 24.38 cm)
Baseboard Power Requirements
ATX 12 V

ENVIRONMENT
Operating Temperature
0° C to +55° C Storage Temperature
-20°C to +70°C

REGULATIONS AND SAFETY STANDARDS
United States and Canada CSA/UL 60950-1, First Edition (Binational Standard)
Europe (Low Voltage Directive 2006/95/EC) EN 60950-1
International IEC 60950-1

EMC REGULATIONS (tested in representative chassis)
United States FCC 47 CFR Part 15, Subpart B Canada ICES-003 Class B
Europe (EMC Directive 2004/108/EC) EN 55022 and EN 55024
Australia / New Zealand EN 55022 Class B
Japan VCCI V-3, V-4 Class B
South Korea KN-22 and KN-24
Taiwan CNS 13438 Class B
International CISPR 22 Class B

ENVIRONMENTAL COMPLIANCE
EUROPE
Europe RoHS (Directive 2002/95/EC)
China China RoHS (MII Order # 39)

(At Release) Support for 3rd generation (IvyBridge) Intel® Core processor family and 2nd generation (SandyBridge) Intel® Core processor family processors with up to 95 W TDP in an LGA1155 socket.
Not backward compatible with socket LGA1156 Processors, but LGA1155/LGA1156 heat sinks are compatible.

Legacy considerations

• No floppy drive connector
• No serial port on the back panel

Download instructions

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